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Small outline package Thin shrink small outline package 2. SON(Small Outline Non-leaded package)はリードがなく、代わりに 電極パッド が接続用の端子として用意されたパッケージです。 電極パッドはパッケージの 2側面 から出ています。. SFA SEMICON’s broad portfolio of Small Outline Package (SOP) include the popular “gullwing” lead formats. 27mm from the next. Currently, Small Outline Transistor (SOT) is used not only for transistors but SOP（Small Out-Line Package）是一种很常见的元件封装形式。SOP封装的应用范围较广，而且以后逐渐派生出SOJ（J型引脚小外形封装）、TSOP（薄小外形封装）、VSOP（甚小外形封装）、SSOP（缩小型SOP）、TSSOP（薄的缩 SSOP（Shrink Small Outline Package）封装和SOP（Small Outline Package）封装是两种常见的表面贴装封装类型。虽然它们在名称上很相似，但在尺寸、引脚密度和应用领域等方面存在一些区别。 SOTとは『Small Outline Transistor』の頭文字を取ったものです。トランジスタのために開発された表面実装用のパッケージです。ピンピッチが0. COMPLIANT TO SOP (Small Outline Package)에 대하여 알아봅니다. [1]Some versions have an exposed pad on the bottom side. With electronics transitioning to smaller sizes and higher component density SMALL OUTLINE PACKAGE 4226367/A 10/2020 NOTES: (continued) 6. 图为SOD-123封装 4、DO. 0 mm. Small Outline Transistor (SOT) packages are very small, inexpensive surface-mount plastic-molded packages with leads on their two long sides. 10 C H 8X 8X b e D D 2 E 2 E E1 2 E1 A A2 A1 The package index contains all outline drawings and Material declarations for those packages. 1 Package description The small outline no-lead (SON)/quad flat no-lead (QFN) is a small size, lead-less plastic package with a low profile, moderate thermal dissipation, and good electrical performance. 25 C 2X 4 TIPS 0. 36 - mm package width ホーム > パッケージ > TI パッケージの検索 > Small Outline (SO) TI パッケージの検索 スモール・アウトライン (SO) パッケージには、SOIC、SOT、すべての SOP スピン (SOP、TSSOP、VSSOP/MSOP) など、さまざまなサイズと変化を持つデュアル・リードの表面実装構成が含まれ SOP(Small Outline Package)とは、電子部品の一種で、主にメモリチップなどにおいて使用されるコンパクトなパッケージのことを指します。 SOPは、その名の通り小型で薄いパッケージであり、高密度実装に適しています。 VSOP Very Small Outline Package VSSOP Very Thin Shrink Small Outline Package, also referred as MSOP = Micro Small Outline Package XCEPT Exceptions - May not be a real Package Product preference code Definition A The small outline integrated circuit (SOIC) package has one of the easiest SMD parts that can be soldered. 7 - mm package width - 4. Unveil how this innovative packaging enables high-density designs, enhanced performance, and cost-effectiveness in Learn about the different types of small outline packages (SOPs), their advantages and disadvantages, and how they are used in various electronic devices. HSOP and PQFP package information Heat sink small outline package (HSOP) and power quad flat package (PQFP) PCB assembly guidelines, Rev. SOP packages typically have gull-wing or J-lead terminals allowing direct surface mounting on the PCB. Highlights • Offered in most standard 小外形封裝，Small Outline Package (SOP)，是兩側具有翼形或J形短引線的一種表面積體電路元件封裝模式。簡介小外形封裝，英文Small Outline Package，縮寫為SOP，是兩側具有翼形或J形短引線的一種適用於積體電路元件的表面黏貼式封裝形式。通常SOP的引腳與引腳之間的間距 SSOP（Shrink Small Outline Package）封装是一种集成电路（IC）封装的类型。它是一种小型封装，常用于高密度和小型化的电子设备中，如移动电话、数码相机、便携式音频播放器等。 SSOP封装是一种表面贴装封装，也被称为SMT（Surface Mount Technology）封装。 SOP (Small Outline Package) is a type of integrated circuit package that features a compact and thin design, typically used for surface-mount applications. 27mm (50mil)的此类封装被称为“SOP”。请注意，JEDEC 标准中所称的“SOP”具有不同的宽度。 plastic, small outline package; 16 leads; 1. They are available in many body sizes and with package thicknesses ranging from 0. 27mm. The contact pads are exposed and flush with the bottom of the package. They are generally available in the same pin-outs as their counterpart DIP ICs. Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material; SOT109-1: SO16: surface mount: double: SO: 9. Resource Library. 000 METAL SOLDER MASK OPENING Different types of integrated circuit packages, Single in-line, Zigzag in-line, Dual in-line, Quad in-line, Ceramic flat pack, Surface-mount small-outline, Surface-mount leadless, Flat pack, Chip carrier, Chip scale, Grid array 16-Lead Standard Small Outline Package [SOIC_W] Wide Body Created Date: 20021126105148Z MSOP - Micro Small Outline Package . 40 5 10 1 6 0. Small Outline Non-leaded package (SON) is a package that has no leads but instead has electrode pads as connection terminals. . Like other surface-mount ICs, SOIC is mounted on the surface of a PCB using SMT (Surface Mount Technology), featuring a smaller footprint and higher pin density. The electrode pads protrude from two sides of the package. Publication IPC-7351 may have alternate designs. This package has an exposed pad on the bottom side. 4w次，点赞26次，收藏92次。SOP、SSOP、TSOP、TSSOP、SOL、SOJ 封装的区别SOP (Small Outline Package):pin脚间距：1. The die is attached to this heat slug, increasing the chip's ability to dissipate heat and thus handle more power. Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. 8mm, 0. Table 3 SON and QFN packages 3. 2. Quad-flat Package (QFP) The Thin Shrink Small Outline Package, or TSSOP, is a rectangular surface mount plastic package with gull-wing leads. 65mm, 0 なお、SOICは『Small Outline Integrated Circuit』の頭文字をとったものであり、『SOL(Small Outline L-leaded package)』や『SO』と表記されることもあります。 なお、ガルウィング形(L字形)のリードがパッケージの 4側面 から出ているものは、 QFP(Quad Flat Package) と呼ばれてい The concept of Small Outline Packages (SOPs) has dramatically transformed the landscape of integrated circuits by providing a compact and versatile packaging solution for electronic components. They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume. 4 - mm The TSSOP logic portfolio comprises functions in 14-, 16-, 20-, and 24- pin packages as well as 16-bit functions in 48- 56- and 64-pin packages. Two surface-mount packages, SOT23 and SOT223, are shown next to through-hole packages. 8. A small outline transistor (SOT) is a family of small footprint, discrete surface mount transistor commonly used in consumer electronics. 55 0. This package conforms to Thermally-enhanced Shrink Small-Outline Package (HSSOP) is a rectangular surface mount plastic integrated circuit (IC) package with gull-wing leads. The Micro Small Outline Package, or micro-SOP or MSOP, is a very small rectangular plastic package with gull wing leads protruding out of its longer sides. Small outline integrated circuit 2. 30 0. They offer improved space efficiency and are compatible with surface-mount technology (SMT). at 10mA/20mV max. SOP，SOT，SOD The Small Outline Integrated Circuit, or SOIC, is a small rectangular surface-mount plastic-molded integrated circuit package with gull wing leads. Operating Temperature Range: –40°C to +170°C –40°C to +150°C (type -004*) Package style descriptive code TSSOP (thin shrink small outline package) Package body material type P (plastic) JEDEC package outline code MO-153 AE Mounting method type S (surface mount) Issue date 08-03-2016 Manufacturer package code 98ARS23923W Table 1. 보다 넓은 의미로 보면 SOIC Package라고 말합니다. Package Description The Small Outline Package (SOP) families comprise dual-inline packages with smaller form factors and typical lead pitch of 0. 27mm です。. Standard package for logic IC: TSSOP: 1. 35: 16: plastic: Manufacture Code Reference Codes Package type descriptive code SO8 Package type industry code SO8 Package style descriptive code SO (small outline) Package body material type P (plastic) IEC package outline code 076E03 JEDEC package outline code MS-012 Mounting method type S (surface mount) Issue date 18-02-2003 Manufacturer package code 98ASA01364D Table 1. Packaging, Quality, Symbols & Footprints. Dimension does not include mold flash, protrusions, or gate burrs. g. 5 mm body 8 April 2020 Package information 0 1 Package summary Terminal position code D (double) Package type descriptive code SO20 Package type industry code SO20 Package style descriptive code SO (small outline) Package body material type P (plastic) SOIC (Small Outline IC Package) is a leadframe based, plastic encapsulated package that is well suited for applications requiring optimum performance in IC packaging. Since Small Outline Transistor (SOT) is a surface mount package developed for transistors, there are many 3-pin SOT. SOTs are a cost effective solution for a wide range of applications. Current Rating: 1A max. IC는 고도로 직접된 Integrated Circuit의 약자입니다. , mobile phones, notebook computers). The SOIC package uses a multi-layer ceramic structure with a standard pin The Shrink Small Outline Package, often referred to as SSOP, is a smaller version of SOIC packaging that integrates surface-mount technology into IC packaging. The leads are typically 0. 85 mm. SOT stands for "Small Outline Transistor". 70 9. 4w次，点赞4次，收藏21次。SOP、SSOP、TSOP、TSSOP、SOL、SOJ 封装的区别SOP (Small Outline Package):pin脚间距：1. Package summary Parameter Min Nom Max Unit package length - 7. They can have a few different variants: SSOP Packages: SSOPs, or shrink small outline packages, have a pin pitch of 0. 5mm (300mil) and 10. 5 mm pitch; 3 mm x 3 mm x 1. SO20, plastic, small outline package; 20 terminals; 1. 0mm, 0. 65mm which is almost half of the SOIC package SOIC（Small Outline Integrated Circuit Package），小外形集成电路封装，指外引线数不超过28条的 小外形集成电路 ，由 SOP (Small Out-Line Package）封装派生而来，一般有宽体和窄体两种 封装形式 。 其中具有翼形短引线者称为SOL器件，具有J型短引线者称为SOJ器件。 SOD stands for "Small Outline Diode". SSOP lead counts range from 8 to 64. SON（Small Outline Non-leaded package） SONは、パッケージの向かい合う2辺にある電極パッドで基板に表面実装できるようになっており、SOPと同様にさまざまなICに使用されています。リード線がないため手付け実装は困難ですが、電気的特性の良さがメリット Small Outline Integrated Circuit Package (SOIC) The SOIC package is a surface mounted device designed to meet the demand for increasing miniaturization and component density. It is available in two materials: plastic and ceramic. Flat no-leads is a surface-mount technology (SMT), one of several package technologies that The Shrink Small Outline Package, or SSOP, is a smaller or 'shrunk' version of the SOIC package, having a compressed body and a tightened lead pitch. 0mm 以上。 SSOP (Shrink Small Outline Package) : 縮小尺寸封裝，基板為金屬材質，兩側有腳且腳距為1. 5 to 1. The Popular Flat Package. SSOP（Shrink Small-Outline Package）および QSOP（Quarter-Size Small Outline Package）は、小さいボディサイズと狭リードピッチを持つ、 IC パッケージングに高性能が要求されるアプリケーションに適したリードフレームベースのパッケージです。 SOIC是Small Outline Integrated Circuit的缩写，意为小型外形集成电路。它是一种常见的集成电路封装类型，通常用于表面贴装技术（SMT）应用，其主要的特点包括： 相对于传统的DIP（Dual Inline Package）封装尺寸更小，因此能够节省空间并增加电路板的密度。 Nexperia_package_poster: Nexperia package poster: Leaflet: 2020-05-15: TSSOP10_SOT552_mk: plastic, thin shrink small outline package; 10 leads; 0. 图为SOP-20封装 2、SOT. Since Small Outline Non-leaded package (SON) has no leads, the package can be made almost the same size as the chip size. They are surface mount packages with gull-wing pins. Mold flash, protrusions, or gate burrs shall not exceed 0. This SOIC variant is particularly well-suited for applications demanding optimal performance in tight lead spacing. Shrink SOP is leadframe based, plastic encapsulated package that are well suited for SSOP(Shrink Small-Outline Package)即窄间距小外型塑封，是1968～1969年飞利浦公司开发出的小外形封装（SOP）设备。 The Very Small Outline Package, or VSOP, is one of several smaller versions of the SOIC package, having a compressed body and a tightened pitch for its gull wing leads. , lighting equipment, switching power supply, microwave ovens, electric cars). 15 per side. 2mm (400mil). the part may be supplied with or without any of the options 4. The Quarter-size SOP comes in two standard body widths: the narrow body which has a nominal body thickness of 150 mils and the wide body which has a nominal body thickness of 300 mils. 25mm in height. They come in various sizes and configurations, with leads on two or four sides of the package. 9 x 3. 3 mm x 2 mm body. The SMD components may be shipped in tubes or tape and reel. For more information, see Texas Instruments literature TSOP - Thin Small Outline Package The Thin Small Outline Package, or TSOP, is a rectangular IC package with a thickness of 1. 65 mm What is the SOIC Package? The Small Outline Integrated Circuit package (SOIC) is among the surface-mount integrated circuit SMD package types and has become widely used in modern electronics. 25 C A-B D A A 0. It has a smaller body and smaller lead pitch than the standard SOIC package. 490) note 4 16 15 14 13 12 11 10 9 1 n pin 1 ident, notch on top and cavities on the bottom of packages are the manufacturing options. Analog SOP (Small Outline Package) is a type of integrated circuit package that features a compact and thin design, typically used for surface-mount applications. In addition they support the widest range of nonvolatile memory component What’s SON Package? Small-outline no-lead package (SON), also known as Flat no-leads, and micro leadframe (MLF). What are the advantages of QFN/SON? Small footprint (yields savings in PCB real estate) Thin package (< 1mm package height) SOP (Small Outline Package)에 대하여 알아봅니다. The lead pitches are 0. It is characterized by a rectangular body with leads that are arranged in a single row on one side of the package. Typical VSOP body widths range from SO、SOP、SOIC封装详解(关于宽体、中体、窄体) 第一篇 一、简介 SOP（ Small Outline Package ）小外形封装，指鸥翼形 (L 形 )引线从封装的两个侧面引出的一 种表面贴装型封装。1968 ～ 1969 年飞利浦公司就开发出小外形封装（ SOP）。以后逐渐派生出 SOJ（ J 型引脚小 外形封装） 、TSOP（薄小外形封装） 、VSOP Small Outline Integrated Circuits (SOIC) have revolutionized the world of electronic components, providing compact and efficient solutions for various applications. 6 Small-outline Package (SOP) This is an even smaller version of the SOIC package. 3 Package cross-section The cross-section drawing in Figure 3 shows a typical HSOP configuration. 20 H 2X 0. 7. The digital PWM topology of the device provides dramatic improvements in efficiency over traditional linear amplifier solutions. 95 mm pitch; 2. The TSO package . Figure 2 shows examples of SOP type packages. cn 主页 > 封装/包装 > 查找 TI 封装 > Small Outline (SO) Thin Small Outline Package (TSOP) 앰코는 IC 디자이너, PCB/시스템 엔지니어, 부품 전문가들의 필요를 만족시키기 위해 유명한 TSOP 1 패키지의 다양한 형태를 제공합니다. 0 mm, 4. There are also ceramic (ceramic quad flat, or LQFP) and plastic (plastic quad flat pack or PQFP). 작고 얇은 이 1. Surface-mount equivalent of the classic through-hole DIP (Dual-Inline Package) 1. Table 1 below shows the various types of SOT packages. TSSOP packages provide 35 to 65 % space saving compared to SOIC solutions. Each SOP includes a plastic small-outline package (PSOP), thin small-outline package (TSOP), and thin-shrink small-outline package (TSSOP). The SSOP package is a variant of SOIC package. 3. 1mm. SOPs or Small Outline Packages are surface-mount packages that are smaller than SOIC packages and with pin pitches lesser than 1. 35 mm body. Explore the emerging technologies and innovations that shape the What is SOP (Small Outline Package)? A Small Outline Package (SOP) represents a class of integrated circuit (IC) packaging that provides a sleek, compact form factor suitable for surface mounting on printed circuit boards What is a SOIC package? The Small Outline Integrated Circuit (SOIC) package is a type of surface-mount IC package that is widely used in the electronics industry. Home. For more information, see Texas Instruments literature a 8-Lead Standard Small Outline Package [SOIC_N] Narrow Body (R-8) Dimensions shown in millimeters and (inches) CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN. Package Outline Drawing M16. A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. 4mm and 6. [2] [3] The small package offers a small footprint, short wires for improved electrical connections, and good moisture reliability. 4 mm and 6. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0. Gull-wing leads: 1. SSOP body widths come in 150, 209 and 300 mils while its body thickness typically ranges from 1. The key technologies for the ultrathin small outline package (TSOP) of large-sized high-speed chips have been designed and developed in this paper. 5mm). These Small Outline Packages give users strong packaging choices for all types of applications. MSOP，Miniature Small Outline Package，翻译为微型小外形封装，是一种电子器件的封装形式，就是两侧具有翼形或J形短引线的一种表面组装元器件的封装形式。 For the most current package drawings, please see the Microchip Packaging Specification located at 8-Lead Plastic Micro Small Outline Package (UA) - 3x3 mm Body [MSOP] Microchip Technology Drawing C04-111-UA Rev D A B 0. Dimension does not include interl ead flash or protrusion. 表面実装パッケージの代表的なもので、幅広く使用されています。SOPは、DIPのリード間隔を半分にし、リードを表面実装向けに先端を外側へカモメの翼（Gull Wing）状に広げています。 さらに Shrink Small Outline Package (SSOP) is a smaller or ‘shrunk’ version of the SOIC package, having a compressed body and a tightened lead pitch. 图为SOT-23封装 3、SOD. (6) TO (transistor outline) package is commonly used to medium and high power devices electronics (e. 2mm to 1. TSOP packages are commonly used in memory devices and have the following characteristics: SOP封装：Small Outline Package，小轮廓封装，适用于集成度较高的芯片，可在面积和功耗上实现优化。 HSO封装：Heterogeneous Small Outline Package，非对称SOP封装，适用于需要区分芯片正反面的场合。 SOIC(Small Outline IC Package)는 최적의 성능을 요구하는 IC 애플리케이션에 적합한 리드프레임 기반 플라스틱 성형 패키지입니다. A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. SOICs are small, rectangular IC packages that have gull-wing leads that extend from the two longer edges and have pin counts of 14 or more. TI’s broad packaging portfolio supports thousands of diversified products, packaging configurations and technologies. 45 9. Flat no-leads packages, such as quad-flat no-leads and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards (PCBs). 업계 표준 패키지는 대량 양산되고 있으며, The common variants have pin counts ranging from 32 to 256 pins. This is true for DIP components, QFN components, and small outline transistor (SOT) package types. 0mm以下。 應用 • 記憶體 • 消費性電子產品 • 手機 • 無線電裝置 • PC設備 • 汽車 • 控制器 small-outline package A package whose chip cavity or mounting area occupies a major fraction of the package area and whose terminals are on one or two (normally opposite) sides and consist of metal pad surfaces (on leadless versions) or leads formed around the sides and under the package or extending out from the package (on leaded versions). The pins extend in an L shape from both sides of the body, with the leads protruding from the longer edge of the package. The SOT-23 and the SC-70 packages are two of the most widely used SOT packages today. The PSOP achieves 40% These SOT package types are very similar, but they need different footprints and land patterns for use in CAD tools. 109 – 10. Rectangular surface mount 3. 5 mm x 12. M SOP lead counts range from 8 to 16. 50 / SOP（Small Outline Package）：这是最常见的SOP封装类型，引脚位于封装的两侧，通常是直插式的。它有多个变种，如SOP8、SOP16、SOP20等，数字表示引脚数量。SOP封装通常用于低功耗和小尺寸的集成电路。 SSOP（Shrink Small Outline Package）：SSOP是 We offer customers a broad integrated circuit (IC) packaging portfolio enabled by years of engineering innovation and expertise. mall Outline Transistor (SOT) Package. Definition and Features: – SOP (Small Outline Package): SOP is a general term referring to compact electronic component packages designed for surface mounting onto printed circuit boards (PCBs). 0mm 패키지는 다양한 환경에서도 안정적으로 작동할 수 SOP(Small Outline Package)の特長 特長：小ピン～中ピンクラスラインアップ、標準パッケージ 構造：リードがパッケージの2側面から取り出され、且つガルウイング形に成形されたパッケージ RECOMMENDED LAND PATTERN Dimension Limits Units Contact Pitch MILLIMETERS 0. SOIC, whose full name is Small Outline Integrated Circuit, is a type of chip package designed to replace the traditional DIP (Dual In-line Package). It has a rectangular Discover the power behind modern miniaturized electronics with SOIC – the Small Outline Integrated Circuit. 27 mm pitch; 7. Another smaller version of the SOIC is the SSOP. The most common SOT are SOT23 variations,. 28-pin QFN, upside down to show contacts and thermal/ground pad. 3mmのSOT-223などがよく使われま III. Plastic integrated circuit (IC) package 4. 95mmのSOT-23、ピンピッチが0. The prime appli SOP stands for Small Outline Package and is an integrated circuit (IC) package that provides a compact and thin form factor for electronic components. It is also smaller and thinner than a TSOP with the same lead count. 8mm. What’s QSOP Package? Quarter-Size Small Outline Package (QSOP) is a small rectangular surface-mount plastic package with gull wing leads protruding out of its longer sides. There are various types of Small Outline Diode (SOD) such as "SOD-123", "SOD-323F", and "SOD-523" depending on the package size and lead shape. A similar package outline that has gull wing leads instead of J-shaped is known as the SOIC. LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SYMM SYMM 1 8 9 16 15. 95mmのSOT-143、ピンピッチが2. Title: RQ-16 Author: Analog devices, Inc. SOD is the name of the package for surface mounting of diodes. Highlights • Higher density TSOP是“Thin Small Outline Package”的缩写，意思是薄型小尺寸封装。TSOP内存是在芯片的周围做出引脚，采用SMT技术（表面安装技术）直接附着在PCB板的表面。 Shrink Small Outline Package; Thin Shrink Small Outline Package; Quarter-size Small Outline Package; Very Small Outline Package; QFP (Quad Flat Package) From four sides the leads are led out in an L-shape, plastic packaging accounts for the vast majority of the other materials are ceramic, metal. Solder mask tolerances between and around signal pads can vary based on board fabrication site. The size of the Mini Small Outline Package is only 3mm × 3mm for the 8 and 10 pin versions [1] and 3mm × 4mm for the 12 and 16 pin version. Small Outline Package Small Outline Packages (SOP) are industry proven surface mount leadframe packages with a body size and height smaller than DIP packages and a tighter leadframe pitch. High utilization across many industries and The Small Outline Integrated Circuit (SOIC) package is one of the most popular and widely used surface mount package types in integrated circuits. Package Index Back to Packaging, Quality, Symbols & Footprints 文章浏览阅读1. SOP/SOJ. 50 BSC 0. Pin pitch is typically 0. 27mm 正常的贴片厚度和脚的间距，小外形封装。在EIAJ 标准中，针脚间距为1. 65 mm to 0. 300 inch) (reference ltc dwg # 05-08-1620) s16 (wide) 0502 note 3. The leads protrude from the longer edge of the package. It is designed to be surface mounted on a printed circuit board Small Outline Package (SOP) is a gull wing (L-shaped) package with leads coming out of two sides of the package. The MSOP is a miniaturized version of the SSOP package, having a smaller footprint than the latter. These packages include traditional ceramic and leaded options and advanced chip scale packages (Quad Flat No Lead (), Wafer Chip Scale Package or Die-Size Ball Grid Array ()), using fine pitch wire bond and flip chip interconnects, with SiP, module, TSOP6, plastic thin small outline package; 6 leads; 0. The designing techniques, such as a 25 µm precise positioning dice attaching technique, a lead frame unit structure without a base island, and a lead co-plane layout inside the frame, were developed. Body widths are 3. 图为DO-14封装 三、归纳总结. It is a miniaturized version of the SSOP (small outline integrated circuit) package, having a smaller footprint than the latter. 05 COMPLIANT TO JEDEC STANDARDS MO-153-AE . PG-TSOP PG-TSSOP PG-SSOP PG = Plastic Green T = Thin S = Shrink SOP = Small Outline Package Figure 2 Examples of SOP packages. 10 3. 9 x 1. Statistically controlled and refined assembly processes coupled with very high quality materials assure the best SOP packages available for your semiconductor devices. The TSSOP come in The ' Small Outline J-Lead Package', or SOJ, is a small rectangular surface-mount plastic-molded integrated circuit package with J-formed leads. Whether you are an electronics enthusiast, hobbyist, or professional engineer, understanding the features and benefits of SOICs will enable you to optimize your circuit designs and create innovative Package type descriptive code SO14 Package type industry code SO14 Package style descriptive code SO (small outline) Package body material type P (plastic) IEC package outline code 076E06 JEDEC package outline code MS-012 Mounting method type S (surface mount) Issue date 19-02-2003 Manufacturer package code 98ASA01365D Table 1. The SOIC package is a rectangular "Dual In-line" style ceramic package. 1 mm. 3 x 2: 16: plastic: Manufacture Code Reference Codes Small Outline Package (SOP): SOP packages are smaller and more compact than DIP-packages. 1 mm body: Package information: 2022 SMALL OUTLINE PACKAGE 4226366/A 10/2020 NOTES: (continued) 6. TSSOP(Thin-Shrink Small Outline Packages) 및 MSOP(Micro Small Outline Packages)는 높이가 1 mm 미만의 애플리케이션에 적합한 리드프레임 기반의 플라스틱 성형 패키지입니다. 패키지의 상부에는 칩이 부착되고, 하부에는 전기적으로 연결되는 핀이 배열되어 있습니다. SOJ(Small Outline J-leaded package)はリードがパッケージの 2側面 から出ており、リード形状が J字形 のパッケージです。 ピンピッチは 1. Due to their low cost and low profile, SOT's are widely used in consumer electronics. 10 MAX 3. 65 mm. 65 mm pitch; 6. Through Hole type Small Outline Package (SOP) Features: Small form factor, low pin count, leadframe, excellent cost performance; Structure: Packages that have “gull-wing” leads on two sides; Intended Use: Consumer equipment, office equipment, etc. Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material; SOT338-1: SSOP16: surface mount: double: SSOP: 6. It is also known as Small Outline Package a 16-Lead Standard Small Outline Package [SOIC_N] Narrow Body (R-16) Dimensions shown in millimeters and (inches) CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN. Example of a HSOP 30 LD case outline drawing 3. It is a surface mount package with metallized terminal pads located at the bottom surface of the package. 20 H 12 N SEE DETAIL B NOTE 1 C 0. 5 mm x 1 mm body 9 June 2020 Package information 1 Package summary Terminal position code D (double) Package type descriptive code TSOP6 Package style descriptive code TSOP (thin small outline package) Package body material type P (plastic) JEITA package outline code 1、 SOP封装 SOP是英文Small Outline Package的缩写，即小外形封装。SOP封装技术由1968～1969年菲利浦公司开发成功，以后逐渐派生出SOJ（J型引脚小外形封装）、TSOP（薄小外形封装）、VSOP（甚小外形封装）、SSOP（缩小型SOP）、TSSOP（薄的缩小型SOP）及SOT（小外形晶体管）、SOIC（小外形集成电路）等。 Small Outline Transistor Small Outline Transistors (SOT) are industry proven surface mount leadframe packages for small footprint applications. The SSOP package is JEDEC- and SOP vs. COMPLIANT TO Package type descriptive code SO8 Package type industry code SO8 Package style descriptive code SO (small outline) Package body material type P (plastic) Mounting method type S (surface mount) Issue date 01-02-2016 Manufacturer package code 98ARH99066A Table 1. While both are surface-mount packages with small outlines, SOP packages typically have a gull-wing or J-lead configuration, whereas SOIC packages have a traditional dual in-line configuration. The See more Thin small outline package (TSOP) is a type of surface mount IC package. Each pin on an SOIC package has a space of about 1. 15 0. 27mm (50mil)的此类封装被称为“SOP”。 请注意，JEDEC 标准中所称的“SOP”具有不同的宽度。 S Thin Shrink Small Outline Package (TSSOP) is a rectangular surface mount plastic integrated circuit (IC) package with gull-wing leads. SOP Packages. 1 mm body: Marcom graphics: 2017-01-28: SOT552-1: plastic, thin shrink small outline package; 10 leads; 0. Texas Instruments (TI) always has been a leader in IC packaging and is now introducing a new family of thin very small-outline packages (TVSOP) to support the component miniaturization requirements of the industry. 398 – . The There is now a vast range of small outline packages (SOPs) on the market, including the very small outline package (VSOP), which typically measures between 3mm and 10mm in body width and 1. They are available in many configurations including MSOP, VSOP, SSOP and TSSOP with body sizes ranging from 150 - 300mils. The pin pitch of the Small Outline Package (SOP) is 50 mils (1. Package summary Parameter Min Nom Max Unit package length - 9. at 500V DC Dielectric Withstanding Voltage: 700V AC for 1 minute Contact Resistance: 30mΩ max. They are suited for applications requiring 1 mm or less mounted height and are commonly used in a 28-Lead Thin Shrink Small Outline Package [TSSOP] (RU-28) Dimensions shown in millimeters 0. It is one of the most commonly SOP（Small Outline Package）小外形封装 ，指鸥翼形(L形)引线从封装的两个侧面引出的一种表面贴装型封装 。 1968～1969年飞利浦公司就开发出小外形封装（SOP） 。 (5) SOT (small-outline transistor) package is commonly used to medium and low power tubes of electronics (e. Small Outline Integrated Circuit (SOIC) Package The Plastic Small Outline Package (PSOP), Thin Small Outline Package (TSOP), and Shrink Small Outline Package (SSOP) are the surface mount memory packaging from Intel. [1] SOT23-5 differs from SOT23 in a wider body of 1. Small Outline Packages, or SOPs, Small Outline Package. It was first introduced by the electronics company Texas S. The number after SOP indicates the TSSOP (Thin Shrink Small Outline Package) stands for a slimmed-down version of the Small Outline Integrated Circuit (SOIC) packaging, Small outline package (SOP) is a type of surface-mount integrated circuit (IC) package. 2 x 5. a 10-Lead Mini Small Outline Package [MSOP] (RM-10) Dimensions shown in millimeters COMPLIANT TO JEDEC STANDARDS MO-187-BA 091709-A 6° 0° 0. 5mmのSOT-89、ピンピッチが1. Lead counts range from 8 to 80. 1. 9 mm x 1. In addition, there are various names for the same package shape depending on the manufacturer. This industry-standard package runs in very-high volume and provides value-added, low-cost solutions for a SOP：小外形封装（Small Outline Package） SOT：小外形晶体管（Small Outline Transistor） SOD：小外形二极管（Small Outline Diode） DO：二极管（diode） 二、举例说明 1、SOP. 0 NXP Semiconductors 3 Figure 2. 413 (10. smaller, thinner, and higher-density packages. 80 0. 5 mm. Package summary Small-outline (SO) packages include a dual row surface mount configuration with a wide variety of sizes and variations including SOIC, SOT, and all SOP spins (SSOP, TSSOP, VSSOP/MSOP). The Type I TSOP has its leads protruding from the shorter edges of TSSOP (Thin Shrink Small Outline Package)薄的缩小型SOP. Interlead The small outline package, called 'Small Outline Integrated Circuit', or SOIC, is a small rectangular surface-mount package with gull-wing leads and either plastic or ceramic molding. For more information, see Texas Instruments literature Package type Properties Application; SOIC: 1. 小引出线封装（small outline package）是2018年公布的计算机科学技术名词。 网页 新闻 贴吧 知道 网盘 图片 视频 地图 文库 资讯 采购 百科 百度首页 Thin Small Outline Package (TSOP)은 반도체 패키지의 하나로, 주로 메모리 칩과 같은 집적회로(IC)를 보호하고 연결하는 데 사용됩니다. 90 COPLANARITY 8-Lead Mini Small Outline Package [MSOP] (RM-8) Dimensions shown in millimeters COMPLIANT TO JEDEC STANDARDS MO-187-AA 6° 0° 0. There are two types of TSOP's. SOT packages offer provisions for surface mounting, which can be valuable in improving their assembly related efficiency. Subject: Outline Dimensions Keywords: 16-Lead Shrink Small Outline Package [QSOP] Created Date: 20030408165518Z 这几个常见封装有细微区别 SOP (Small Outline Package): pin脚间距：1. 00 2. Small Outline Integrated Circuit. 9 mm x 3. Small-Outline Transistor (SOT) SOT packages are small available for transistors and diodes and used in power control and switching application. 15B 16 LEAD QUARTER-SIZE SMALL OUTLINE PLASTIC PACKAGE (QSOP) Rev 0, 9/16 NOTES: 1. 15 1. SOIC: Understanding the Differences. 70 0. Variants include SOJ (Small Outline J-Leaded Package), TSOP (Thin Small Outline Package), SSOP (Shrink Small Outline Package), TSSOP (Thin Shrink Small Outline Package), QSOP (Quarter-size Small Outline Package), and VSOP sw package 16-lead plastic small outline (wide . The SOJ is also sometimes referred to as 'SOIJ', or J-leaded small outline IC package. This package is designed to be soldered to a thermal pad on the board. 27mm). The standard pitch is nominally 1. They are suitable for high density thanks to their compact form. Lead Pitch: 0. 구조 TSOP는 칩을 보호하기 위해 슬림한 외형을 가지고 있습니다. Pricing pressures are encouraging strong efforts toward cost reduction. Wikepedia에서는 SOIC(Small Outline Integrated Circuit) Package 중 하나로 소개하고 있습니다. SOPs and QFPs are the surface-mount champions, designed for direct soldering onto SMALL OUTLINE PACKAGE 4220204/A 02/2017 NOTES: (continued) 6. J字形のリードは変形しにくいというメリットがあります。 A small outline package (SOP) is one of the surface-mount packaging types, with pins extending from both sides of the package in the shape of seagull wings (L-shape). Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology, one of several package SMALL OUTLINE PACKAGE 4230058/A 10/2023 NOTES: (continued) 6. 업계 표준 패키지는 대량 양산되고 있으며, 다양한 애플리케이션에 저비용 고부가가치 솔루션을 제공합니다. Package summary 文章浏览阅读5. Similar to SOIC, the SOP family has a smaller form factor, with pin spacing of less than 1. The pins are drawn in an L shape from both sides of the body, with the leads extending from the longer edge of the package. It provides a standardized form factor and layout for electronic components, facilitating efficient assembly and integration into electronic devices. The Thin shrink small outline package has a smaller body and smaller lead pitch than the standard SOIC package. 27mm (50mil)的此类封装被称为“SOP”。请注意，JEDEC 标准中所称的“SOP”具有不同的宽度。 The Thin Shrink Small Outline Package (TSSOP) offers smaller body sizes, smaller lead pitches and package thickness (0. 0mm, 4. Mini Small Outline Package, Mini-SOP or MSOP, is a very small rectangular plastic package with gull wing leads protruding out of its longer sides. 65 mm to 1. Size comparison of transistor packages. The Power Small Outline Package, or PSOP, is a rectangular small outline IC package developed by Amkor that integrates a copper heat slug in its plastic body. 27mm (50mil). com. 28 lead ceramic small outline package, eprom ns package number mc28b life support policy national’s products are not authorized for use as critical components in life support devices or systems without the express written approval of the president and general 半導体用語集. 60 0. You can never tell exactly what function a component provides just by looking at its package. The pin pitches include 1. 65 BSC The Thin Small Outline Package (TSOP) is a variation of the SOIC design, offering an even lower profile for applications where vertical space is at a premium. SOP（Small Outline Package）型およびSOIC（Small Outline Integrated Circuit）型は、いずれも表面実装技術におけるパッケージングの種類であり、基本的に集積回路をパッケージングするために使用されます。ただし、パッケージング構造とピン配置が異なります。 plastic, shrink small outline package; 16 leads; 0. SOJ packages are JEDED-compliant and come in a variety of body widths, the most popular of which are 7. Typical V SOP lead counts range from 8 to 40. 8 mm x 2. 英語表記：Small Outline Package/ Small Outline J-leaded package 表面実装型パッケージの一つ。小ピン用途の表面実装型パッケージとしては代表的なものであり，主として，アドレスや入出力端子の数が少ないメモリ製品に広く適用される。 SON stands for "S mall O utline N on-leaded package". 45 0. 5 or 0. 27 mm pitch; 9. Title: RU-28 Author: Analog Devices Subject: Outline Dimensions Keywords: 28-Lead Thin Shrink Small Outline Package [TSSOP] Created Date: DIP Chip Package. 45 NOM *SOP (Small Outline Packages, Gullwing Leads) Specifications Insulation Resistance: 1,000MΩ min. The lead counts range from 8 to 80 pins. 薄型收缩小外形封装 (TSSOP)是一种带有鸥翼引线 的矩形表面贴装塑料集成电路 SOP (Small Outline Package) : 小尺寸封裝，基板為金屬材質，兩側有腳且腳距為1. 查找 SO (Small-outline) 封装结构图和说明书，如引脚数、间距和尺寸。 查找所有 TI 封装 | 德州仪器 TI. SOP (Small Outline Package) & QFP (Quad Flat Package) As technology advanced and devices shrunk, so did the IC packages. 65 BSC MIN E MAX Contact Pad Length (X8) Contact Pad Width (X8) Y X 1. 2 mm x 5. In some applications, they are being supplanted by ball grid array packages which can achieve even higher densities. 9mm thick) than standard SOIC packages. The body sizes are typically smaller than a standard package. Our package options range from traditional leaded and leadless packages (small outline package (SOP), quad flat package (QFP) and quad flat no-lead (QFN)) to advanced ball grid arrays using wire bond and flip-chip interconnects and wafer The main difference between SOP (Small Outline Package) and SOIC (Small Outline Integrated Circuit) package lies in their pin configurations. 40 4 8 1 5 0. The s mall outline transistor (SOT) package family consists of many types of very small and inexpensive surface-mount packages used for discrete components and simple IC's. リードがないため、チップサイズとほぼ同じ大きさでパッケージを製作することができます。 QFN/SONs are packages with a plastic small outline and no lead, with no lead extending beyond the package body. vgkbyh aoqqg slm wer deinie sgiyluy puulzczaj vsnsch keauvl zuffis cqhu rzds boe rrhdd viagc